Configurable all-in-one modular desktop computing system

ABSTRACT

A modular desktop computing system includes a display stand chassis having a display stand base, a display stand support member extending from the display stand base and including a display device mounting subsystem, and a display stand cover removeably coupled to the display stand support member to define a computing module housing between the display stand support member and the display stand cover. A display device is removeably mounted to the display device mounting subsystem. A computing module is located in the computing module housing. The computing module includes a computing module chassis removeably positioned in the computing module housing and housing: a processing system coupled to the display device, and a memory system coupled to the processing system. The memory system includes instructions that, when executed by the processing system, cause the processing system to provide for the display of images on the display device.

CROSS-REFERENCE TO RELATED APPLICATIONS

This is a Continuation application to United States Utility applicationSer. No. 16/010,195 filed Jun. 15, 2018, entitled “CONFIGURABLEALL-IN-ONE MODULAR DESKTOP COMPUTING SYSTEM” Attorney Docket No.16356.1922US01, the disclosure of which is incorporated herein byreference in its entirety.

BACKGROUND

The present disclosure relates generally to information handlingsystems, and more particularly to a modular desktop information handlingsystem that is configurable as an all-in-one computing device.

As the value and use of information continues to increase, individualsand businesses seek additional ways to process and store information.One option available to users is information handling systems. Aninformation handling system generally processes, compiles, stores,and/or communicates information or data for business, personal, or otherpurposes thereby allowing users to take advantage of the value of theinformation. Because technology and information handling needs andrequirements vary between different users or applications, informationhandling systems may also vary regarding what information is handled,how the information is handled, how much information is processed,stored, or communicated, and how quickly and efficiently the informationmay be processed, stored, or communicated. The variations in informationhandling systems allow for information handling systems to be general orconfigured for a specific user or specific use such as financialtransaction processing, airline reservations, enterprise data storage,or global communications. In addition, information handling systems mayinclude a variety of hardware and software components that may beconfigured to process, store, and communicate information and mayinclude one or more computer systems, data storage systems, andnetworking systems.

A growing trend in information handling systems is the “all-in-one”desktop computing system, also referred to as all-in-one PersonalComputers (PCs). All-in-one desktop computing systems integrate thecomputing system chassis and computing system components into thedisplay device so that the entire desktop computing system is providedas a single unit. All-in-one desktop computing systems typically providea smaller form factor relative to non-all-in-one desktop computingsystems, but are associated with higher costs, weaker performance, andlimited upgrade options relatively to convention desktop computingsystems. In particular, non-all-in-one desktop computing systems allow auser to upgrade their performance by adding or changing components,while all-in-one desktop computing systems are typically limited to thecomponents that were initially integrated into the display device. Assuch, a user that purchases an all-in-one desktop computing system willbe “stuck” with the integrated display device, processing system, memorysystem, storage system, and/or other computing components that wereinitially provided with the all-in-one desktop computing system, andmust purchase a new all-in-one desktop computing system if an upgrade ofthe performance of the all-in-one desktop computing system is desired.

Accordingly, it would be desirable to provide an improved all-in-onedesktop computing system.

SUMMARY

According to one embodiment, an Information Handling System (IHS)includes a display stand chassis base; a display stand chassis supportmember that extends from the display stand chassis base and thatincludes a display device mounting subsystem that is configured toremoveably mount to a display device; and a display stand chassis coverthat is configured to removeably couple to the display stand supportmember to define a computing module housing between the display standsupport member and the display stand cover, wherein the computing modulehousing is configured to removeably house a computing module thatincludes a processing system that is configured to couple to the displaydevice, and a memory system that is coupled to the processing system andthat includes instructions that, when executed by the processing system,cause the processing system to provide for the display of images on thedisplay device.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a schematic view illustrating an embodiment of an informationhandling system.

FIG. 2A is an exploded perspective view illustrating an embodiment of adisplay stand chassis.

FIG. 2B is a front view illustrating an embodiment of the display standchassis of FIG. 2A.

FIG. 2C is a partial, cross-sectional side view illustrating anembodiment of the display stand chassis of FIGS. 2A and 2B.

FIG. 3A is a bottom perspective view illustrating an embodiment of acomputing module.

FIG. 3B is a partial, cross-sectional side view illustrating anembodiment of the computing module of FIG. 3A.

FIG. 3C is a partial, cross-sectional bottom view illustrating anembodiment of the computing module of FIGS. 3A and 3B.

FIG. 4 is a partial, cross-sectional side view illustrating anembodiment of a computing module.

FIG. 5 is a flow chart illustrating an embodiment of a method forproviding a modular desktop computing system that is configurable as anall-in-one computing device.

FIG. 6A is an exploded perspective view illustrating an embodiment ofthe computing module of FIGS. 3A-C used with the display stand chassisof FIGS. 2A-C and a display device.

FIG. 6B is a front view illustrating an embodiment of the computingmodule, display stand chassis, and display device of FIG. 6A.

FIG. 6C is a partial, cross-sectional side view illustrating anembodiment of the computing module, display stand chassis, and displaydevice of FIGS. 6A and 6B.

FIG. 7A is an exploded perspective view illustrating an embodiment ofthe computing module of FIG. 4 used with the display stand chassis ofFIGS. 2A-C and a display device.

FIG. 7B is a partial cross-sectional side view illustrating anembodiment of an expansion device being coupled to the computing moduleof FIG. 4 for use with the display stand chassis of and the displaydevice of FIG. 7A.

FIG. 7C is a partial cross-sectional side view illustrating anembodiment of the expansion device coupled to the computing module ofFIG. 4 for use with the display stand chassis of and the display deviceof FIG. 7A.

FIG. 8 is a rear perspective view illustrating the computing module ofFIGS. 3A-C used with a display system.

FIG. 9A is a front perspective view illustrating an embodiment of adisplay system with an integrated docking subsystem.

FIG. 9B is a front perspective view illustrating an embodiment of thecomputing module of FIGS. 3A-c connected to the display system with theintegrated docking subsystem of FIG. 9A.

DETAILED DESCRIPTION

For purposes of this disclosure, an information handling system mayinclude any instrumentality or aggregate of instrumentalities operableto compute, calculate, determine, classify, process, transmit, receive,retrieve, originate, switch, store, display, communicate, manifest,detect, record, reproduce, handle, or utilize any form of information,intelligence, or data for business, scientific, control, or otherpurposes. For example, an information handling system may be a personalcomputer (e.g., desktop or laptop), tablet computer, mobile device(e.g., personal digital assistant (PDA) or smart phone), server (e.g.,blade server or rack server), a network storage device, or any othersuitable device and may vary in size, shape, performance, functionality,and price. The information handling system may include random accessmemory (RAM), one or more processing resources such as a centralprocessing unit (CPU) or hardware or software control logic, ROM, and/orother types of nonvolatile memory. Additional components of theinformation handling system may include one or more disk drives, one ormore network ports for communicating with external devices as well asvarious input and output (I/O) devices, such as a keyboard, a mouse,touchscreen and/or a video display. The information handling system mayalso include one or more buses operable to transmit communicationsbetween the various hardware components.

In one embodiment, IHS 100, FIG. 1, includes a processor 102, which isconnected to a bus 104. Bus 104 serves as a connection between processor102 and other components of IHS 100. An input device 106 is coupled toprocessor 102 to provide input to processor 102. Examples of inputdevices may include keyboards, touchscreens, pointing devices such asmouses, trackballs, and trackpads, and/or a variety of other inputdevices known in the art. Programs and data are stored on a mass storagedevice 108, which is coupled to processor 102. Examples of mass storagedevices may include hard discs, optical disks, magneto-optical discs,solid-state storage devices, and/or a variety other mass storage devicesknown in the art. IHS 100 further includes a display 110, which iscoupled to processor 102 by a video controller 112. A system memory 114is coupled to processor 102 to provide the processor with fast storageto facilitate execution of computer programs by processor 102. Examplesof system memory may include random access memory (RAM) devices such asdynamic RAM (DRAM), synchronous DRAM (SDRAM), solid state memorydevices, and/or a variety of other memory devices known in the art. Inan embodiment, a chassis 116 houses some or all of the components of IHS100. It should be understood that other buses and intermediate circuitscan be deployed between the components described above and processor 102to facilitate interconnection between the components and the processor102.

Referring now to FIGS. 2A, 2B, and 2C, an embodiment of display standchassis 200 is illustrated that may be utilized to provide the modulardesktop computing system of the present disclosure that is configurableas an all-in-one computing device. As will be appreciated by one ofskill in the art in possession of the present disclosure, the modulardesktop computing system of the present disclosure may provide a versionof the IHS 100 discussed above with reference to FIG. 1 and, as such,may include some or all of the components of the IHS 100. As discussedbelow, the modular desktop computing system of the present disclosure isprovided by a computing module that provides the compute functionality(e.g., processing, storage, networking, etc.) of the modular desktopcomputing system, with that computing module housed in the display standchassis 200 that supports a display device. Furthermore, the inventorsof the present disclosure have developed a number of system andsubsystem improvements that may be utilized with the modular desktopcomputing system of the present disclosure, and those improvements aredescribed in co-pending U.S. patent application Ser. No. 16/010,013,Attorney Docket No. 16356.1918US01, filed on Jun. 15, 2018; U.S. patentapplication Ser. No. 15/973,203, Attorney Docket No. 16356.1919US01,filed on May 7, 2018; U.S. patent application Ser. No. 15/987,752,Attorney Docket No. 16356.1920US01, filed on May 23, 2018; and U.S.patent application Ser. No. 15/973,234, Attorney Docket No.16356.1921US01, filed on May 7, 2018; the disclosures of which areincorporated by reference herein in their entirety.

In the illustrated embodiment, the display stand chassis 200 includes adisplay stand base 202, with a display stand support member 204 that ismounted to and extends substantially perpendicularly from the displaystand base 202. As discussed below, the mounting of the display standsupport member 204 to the display stand base 202 may be a removeablemounting that allows different display stand support members to bemounted to the display stand base 202, as discussed below. As such, thedisplay stand base 202 and the display stand support member 204 mayinclude a variety of coupling, securing, and release features that wouldbe apparent to one of skill in the art in possession of the presentdisclosure as providing for the removeable coupling of the two.

For example, in the illustrated embodiment, the display stand supportmember 204 defines a first display stand housing portion 204 a adjacenta display stand wall 204 b that includes a display stand outer surface204 c. Furthermore, the display stand chassis 200 in the illustratedembodiment also includes a display stand cover 206 that defines a seconddisplay stand housing portion 206 a, with the display stand cover 206configured to couple to the display stand support member 204 such thatthe first display stand housing portion 204 a and the second displaystand housing portion 206 a define a display stand chassis housing 208.In some embodiments, the display stand chassis 200 may be provided witha first display stand support member that is configured (e.g., with thedisplay stand cover 206) to define a first sized display stand housing,or may be provided with a second display stand support member that isconfigured (e.g., with the display stand cover 206) to define a secondsized display stand housing that is larger than the first display standhousing. As such, as discussed below, different display stand supportmembers may be mounted and secured to, and removed from the displaystand base 202 in order to be replaced by other display stand supportmembers to provide a variety of benefits, only some of which arediscussed below. In a specific example, the display stand chassis 200may include a Kensington-type security slot that support Kensington-typelocks that may be configured to, for example, secure the display standcover 206 to the display stand support member 204 in order to preventaccess to the computing module 300, discussed in further detail below.

In the illustrated embodiment, the display stand chassis housing 208includes a display stand heat dissipation aperture 208 a that is locatedopposite the display stand chassis 202 from the display stand base 202.As discussed in further detail below, the display stand heat dissipationaperture 208 a may provide an air outlet for the display stand chassishousing 208 and computing module 300. As illustrated, the display standsupport member 204 includes a display device mounting subsystem 210 thatextends from the display stand outer surface 204 c, and which mayinclude a variety of display stand mounting subsystems known in the artsuch as, for example, display stand mounting subsystems defined by theVideo Electronics Standards Association (VESA). In addition, the displaystand cover 206 may also define a display stand cover aperture 206 bthat, as discussed below, provides an air inlet that allows for air tobe drawn into the display stand chassis housing 208 and the computingmodule 300. Furthermore, the display stand support member 204 may alsodefine a display stand support member aperture 212 that extends throughthe display stand support member 204 and that is located adjacent thedisplay stand cover aperture 206 b in order to define a cable routingaperture through the display stand chassis 200.

Referring now to FIGS. 3A, 3B, and 3C, an embodiment of a computingmodule 300 is illustrated. In an embodiment, the computing module 300may be the IHS 100 of FIG. 1, and/or may include some or all of thecomponents of the IHS 100. As discussed above, the computing module 300may be housed in the display stand chassis 200 of FIGS. 2A, 2B, and 2C,and coupled to a display device on that display stand chassis 200.However, the teaching of the present disclosure may be beneficial to avariety of devices and/or systems, and thus those devices and systemsare envisioned as falling within the scope of the present disclosure aswell. In the illustrated embodiment, the computing module 300 includes acomputing chassis 302 that may house components (e.g., of the IHS 100),only some of which are illustrated in FIGS. 3A-C. The computing chassis302 includes a computing chassis top outer surface 302 a, a computingchassis bottom outer surface 302 b that is located opposite thecomputing chassis 302 from the computing chassis top outer surface 302a, a computing chassis front outer surface 302 c that extends betweenthe computing chassis top outer surface 302 a and the computing chassisbottom outer surface 302 b, a computing chassis rear outer surface 302 dthat is located opposite the computing chassis 302 from the computingchassis front outer surface 302 c and that extends between the computingchassis top outer surface 302 a and the computing chassis bottom outersurface 302 b, and a pair of opposing computing chassis side outersurfaces 302 e and 302 f that are located opposite the computing chassis302 from each other and that extend between the computing chassis topouter surface 302 a, the computing chassis bottom outer surface 302 b,the computing chassis front outer surface 302 c, and the computingchassis rear outer surface 302 d.

As illustrated in FIGS. 3B and 3C, the computing chassis 302 defines acomputing chassis housing 304 between the computing chassis top outersurface 302 a, the computing chassis bottom outer surface 302 b, thecomputing chassis front outer surface 302 c, the computing chassis rearouter surface 302 d, and the computing chassis side outer surfaces 302 eand 202 f, and that computing chassis housing 304 may be utilized tohouse components (e.g., of the IHS 100). As can be seen in FIGS. 3B and3C, the components housed in the computing chassis housing 304 mayinclude a board 306 (e.g., a motherboard) to which a first component 308and a second component 310 are mounted. In some embodiments, the firstcomponent 308 and/or the second component 310 may be provided by, forexample, a processing system (e.g., a Central Processing Unit (CPU)), amemory system (e.g., Dynamic Random Access Memory (DRAM) devices),and/or a variety of other computing devices that would be apparent toone of skill in the art in possession of the present disclosure.However, in other embodiments, the first and second components (and/orother components in the computing chassis housing 304) may be providedby any devices that would be apparent to one of skill in the art inpossession of the present disclosure. While not described herein indetail the computing chassis 302 may be opened by a user to add orreplace components (e.g., a processor, memory devices, networkingdevices, storage devices, etc.) using any of a variety of techniquesknown in the art.

In the illustrated embodiment, a forced convection device 312 is locatedon the board 306 and in the computing chassis housing 304 between theboard 306 and the computing chassis wall of the computing chassis 302that includes the computing chassis top outer surface 302 a. The forcedconvection device 312 may be provided by a fan, a blower, and/or otherforced convection devices that would be apparent to one of skill in theart in possession of the present disclosure. A heat dissipationstructure 314 is located in the computing chassis housing 304 adjacentthe forced convection device 312, and in the illustrated embodimentincludes a plurality of spaced apart heat dissipation fins 314 a thatdefine a plurality of airflow channels (i.e., between the heatdissipation fins 314 a) extending from the forced convection device 312.A heat transfer device 316 (e.g., a heat pipe, a vapor chamber, or otherheat transfer subsystem that would be apparent to one of skill in theart in possession of the present disclosure) is located in the computingchassis housing 304, engages the heat dissipation structure 314, extendsthrough the computing chassis housing 304 while engaging the computingchassis wall that includes the bottom outer surface 302 b of thecomputing chassis 302, and engages the first heat producing component308.

While not illustrated, one of skill in the art in possession of thepresent disclosure will recognize that thermal substrates (e.g., heattransfer pastes) may be provided between the engagement of the heattransfer device 316 and the heat dissipation structure 314, theengagement of the heat transfer device 316 and the computing chassiswall that includes the bottom outer surface 302 b of the computingchassis 302, and the engagement of the heat transfer device 316 and thefirst heat producing component 308 (e.g., the engagement of theevaporator side of the heat pipe and a Central Processing Unit (CPU)).While the heat transfer device 316 is described as a heat pipe thatengages the computing chassis wall that includes the bottom outersurface 302 b of the computing chassis 302, in other embodiments theheat transfer device 316 may be integrated, embedded, or otherwiseengaged with the computing chassis wall that includes the bottom outersurface 302 b of the computing chassis 302 in a variety of manners thatwill fall within the scope of the present disclosure as well.

In the illustrated embodiment, a computing chassis housing air inlet 318a is defined by the computing chassis wall of the computing chassis 302that includes the computing chassis rear outer surface 302 d. Asdiscussed below, the computing chassis housing air inlet 318 a isconfigured to allow air to be drawn from outside the computing chassis302 and into the computing chassis housing 304 to the forced convectiondevice 312. Furthermore, a computing chassis heat dissipation aperture320 is defined by the wall of the computing chassis 302 that includesthe computing chassis front outer surface 302 c of the computing chassis302, and is located immediately adjacent the heat dissipation fins 314 aand opposite the heat dissipation fins 314 a from the forced convectiondevice 312. As discussed below, the forced convection device 312 isconfigured to produce an airflow that is directed through the channelsdefined by the heat dissipation fins 314 a, and out the computingchassis heat dissipation aperture 320. However, while specific airinlets and outlets have been illustrated and described, one of skill inthe art in possession of the present disclosure will recognize that airinlets and outlets for the computing module 300 may be located in avariety of locations that will fall within the scope of the presentdisclosure.

While not illustrated, the computing module 300 may include a variety ofconnectors for connecting the computing module 300 to a display device(discussed below), a power supply, peripheral devices, and/or otherdevices known in the art. For example, such connectors may includeUniversal Serial Bus (USB) connectors (e.g., USB Type C connectors),networking connectors (e.g., RJ45 connectors), audio connectors (e.g.,Universal Audio Jack (UAJ) connectors), video connectors (e.g., DisplayPort connectors), power connectors (e.g., Direct Current (DC)connectors), and/or any other connector that would be apparent to one ofskill in the art in possession of the present disclosure. While aspecific computing module 300 has been described, one of skill in theart in possession of the present disclosure will recognize thatcomputing modules may include a variety of other components and/orcomponent configurations that will fall within the scope of the presentdisclosure as well.

Referring now to FIG. 4, an embodiment of a computing module 400 isillustrated that is substantially similar to the computing module 300 ofFIGS. 3A-3C and, as such, includes similar element numbers for similarcomponents. One of skill in the art in possession of the presentdisclosure will recognize that the computing module 400 differs from thecomputing module 300 due to the provisioning of an expansion deviceconnector 402 that is accessible on the computing chassis top outersurface 302 a, and a connector coupling 404 extending between theexpansion device connector 402 and the board 306. In the embodimentsillustrated and discussed below, the computing module 300 may beutilized with the display stand chassis 200 that includes a firstdisplay stand support member that is configured (e.g., with the displaystand cover 206) to define a relatively small display stand housing,providing a relatively small all-in-one computing device using themodular desktop computing system of the present disclosure. Furthermore,in the embodiments illustrated and discussed below, the computing module400 may be utilized with the display stand chassis 200 that includes asecond display stand support member that is configured (e.g., with thedisplay stand cover 206) to define a relatively large display standhousing, providing a relatively larger all-in-one computing device usingthe modular desktop computing system of the present disclosure that maybe configured (or configurable with expansion devices) to provide arelatively higher degree of performance compared to the computing module300. However, while a few examples are provided, one of skill in the artin possession of the present disclosure will understand that the modulardesktop computing system may utilize a variety of different computingmodules to provide different functionality while remaining within thescope of the present disclosure as well.

Referring now to FIG. 5, an embodiment of a method 500 for providing amodular desktop computing system that is configurable as an all-in-onecomputing device is illustrated. As discussed below, embodiments of thesystems and methods of the present disclosure provide modular desktopcomputing system with a computing module removeably housed in a displaystand chassis that is configured to support any of a variety of displaydevices, with the computing module configurable to upgrade and/or addcomponents to provide different operating levels for the modular desktopcomputing system. In specific examples, the modularity of the computingmodule allows for additions of and/or replacement of processing systems,memory systems, storage systems, networking systems, power systems,and/or any other computing components that would be apparent to one ofskill in the art in possession of the present disclosure. Furthermore,the modularity of the display stand chassis allows for the housing ofdifferent sized computing modules, and different sizes and types ofdisplay devices. As such, the issues discussed above with regard torelatively weaker performance and relatively limited upgrade options onconventional all-in-one computing devices are remedied, as the modulardesktop computing system of the present disclosure is configurable as anall-in-one computing device that provides a variety of use cases thatallow a user to upgrade performance by adding or changing components,rather than being limited to the components that were initiallyintegrated into the display device.

The method 500 begins at block 502 where a display device is mounted toa display stand chassis support member. Referring to FIGS. 6A, 6B, and6C, in an embodiment of block 502, a display device 600 is coupled tothe display stand chassis 200 via the display device mounting subsystem210. As discussed above, the display device mounting subsystem 210 maybe defined according to VESA specifications, and one of skill in the artin possession of the present disclosure will recognize that any of avariety of display devices desired by a user may be coupled to such adisplay device mounting subsystem 210 at block 502. The display device600 includes a display screen 600 a and, while not illustrated, may alsoinclude a variety of display device connectors (e.g., for connecting tothe computing module as discussed below), as well as any other displaydevice features that would be apparent to one of skill it the art inpossession of the present disclosure.

The method 500 then proceeds to block 504 where a computing module ispositioned in a computing module housing defined by the display standchassis support member. With reference to FIGS. 6A and 6C, in anembodiment of block 504, the computing module 300 of FIGS. 3A-C may bepositioned in the display stand chassis housing 208 defined between thedisplay stand cover 206 and the display stand support member 204 (e.g.,.via the first display stand housing portion 204 a and the seconddisplay stand housing portion 206 a as discussed above.) While notillustrated, one of skill in the art in possession of the presentdisclosure will recognize that the display stand chassis 200 may includea variety of mounting structures, securing elements, connections (e.g.,display connections, power connections, etc.), and/or any other featuresthat enable the computing module 300 to be coupled to the display standchassis 200 (e.g., in the display stand chassis housing 208), as wellenable the components in the computing module 300 to be coupled to thedisplay device 600, a power source, and/or other computing systemelements (e.g., peripheral devices) while remaining within the scope ofthe present disclosure. As illustrated in FIGS. 6A and 6B, in anembodiment, the computing module 300 may be positioned in the displaystand chassis housing 208 of the display stand chassis 200 such that thecomputing module heat dissipation aperture 320 is located immediatelyadjacent the display stand heat dissipation aperture 208 a, and thecomputing chassis housing air inlet 318 a is located adjacent thedisplay stand chassis housing air inlet 206 b such that air may be drawnfrom outside the display stand chassis 200 and into the computingchassis housing 304.

With reference to FIGS. 7A, an embodiment of the computing module 400 ofFIG. 4 being positioned in a computing module housing defined by thedisplay stand chassis support member is illustrated. As will beappreciated by one of skill in the art in possession of the presentdisclosure, the display stand chassis 200 in FIG. 7A may besubstantially similar to the display stand chassis discussed above withreference to FIGS. 2A-C, and may be utilized in the embodiment discussedabove with reference to FIGS. 6A-C, with the exception of including adisplay stand chassis housing (defined between the display stand cover206 and the display stand support member 204 by the first display standhousing portion 204 a and the second display stand housing portion 206 aas discussed above) that is larger than the display stand chassishousing 208 discussed above with reference to FIGS. 6A-C. For example,as illustrated in FIGS. 7B and 7C, an expansion device 700 that includesa computing module connector 702 may be positioned adjacent thecomputing module 400 such that the computing module connector 702 isaligned with the expansion device connector 402 on the computing module400, and then moved in a direction A so that the computing moduleconnector 702 engages the expansion device connector 402 to couple theexpansion device 700 to the computing module 400, as illustrated.

In different embodiments, the expansion module 700 may include agraphics processing device configured to enable the computing module 400to perform graphics processing, a hard drive configured to provideadditional storage for the computing module 400, a battery configured toprovide additional power for the computing module 400, a networkingdevice configured to provide networking functionality (e.g., wirelessnetworking) for the computing module 400, and/or any other computingcomponents for adding functionality to the computing module 400. In onespecific example, the expansion device 700 may include an M.2 wirelessdevice and a 2.5″ Serial AT Attachment (SATA) drive, as well as aplurality of Display Port connectors and a DC connector. In anotherspecific example, the expansion device 700 may include an M.2 SolidState Drive (SSD), and a 2.5″ SATA drive, along with a DC connector. Inyet another example, the expansion device 700 may include a battery anda DC connector. While not illustrated, the computing module 400 and/orthe expansion device 700 may include a variety of coupling features formechanically and electronically coupling the two together, as well asother features (e.g., heat sinks, etc.) that would be apparent to one ofskill in the art in possession of the present disclosure.

As would be appreciated by one of skill in the art in possession of thepresent disclosure, the embodiments illustrated in FIGS. 6A-C and 7A-Cprovide just one example of the configurability of the modular desktopcomputing system of the present disclosure as an all-in-one computingdevice. For example, the display stand support member 204 may be thesame in both embodiments, and different display stand covers (similar tothe display stand cover 206) may be provided that, when coupled to thedisplay stand support member 204, define different sized display chassishousings 208 that enable the positioning of different sized computingmodules (e.g., a first sized display chassis housing for housing thecomputing module 300 in FIGS. 6A-C, a second larger sized displaychassis housing for housing the computing module 400 and expansiondevice 700 in FIGS. 7A-C, etc.) However, while a specific example hasbeen described, one of skill in the art in possession of the presentdisclosure will recognize that the display stand chassis 300 may beprovided with other features for enabling the modularity describedherein while remaining within the scope of the present disclosure.

The method 500 then proceeds to block 506 where the computing module iscoupled to the display device. In an embodiment, at block 506, thecomputing module 300/400 may be coupled to the display device 600 in avariety of manners. For example, in some embodiments, the computingmodule 300/400 and the display device 600 may be coupled together viacabling, which may be connected to display device connectors (notillustrated) on the display device 600 a and to computing moduleconnectors (not illustrated) on the computing module 300/400, and routedthrough the cable routing aperture in the display stand chassis 200provided by the display stand support member aperture 212 and thedisplay stand cover aperture 206 b. In other embodiments, the displaydevice 600 and the computing module 300/400 may be each be connected todisplay stand chassis connectors (not illustrated) on the display standchassis 200 in order to be coupled together (e.g., via internalconnections within the display stand chassis 200). For example, thecabled connections between the display device 600 and the display standchassis 200 may be provided, and the computing module 300/400 mayinclude a connector for directly connecting to the display stand chassis200 when it is positioned in the display stand chassis housing 208.However, while a few examples have been provided, one of skill in theart in possession of the present disclosure will recognize that thecomputing module 300/400 and the display device 600 may be coupledtogether in any of a variety of manners that will fall within the scopeof the present disclosure as well.

The method 500 then proceeds to block 508 where a computing moduleprovides for the display of images on the display device. In anembodiment, at block 508, the computing module 300/400 and the displaydevice 600 may be operated such that the computing module 300/400provides for the display of images on the display device 600 (e.g., viathe connections provided between the two at block 506.) As would beunderstood by one of skill in the art in possession of the presentdisclosure, cooling subsystems in the computing module 300/400 (e.g.,the forced convection device 312) may be operated at block 508 todissipate heat generated within the computing module housing 304 via thedisplay stand heat dissipation aperture 208 a.

Referring now to FIG. 8, an embodiment of the computing module 300 ofFIGS. 3A-C utilized with a conventional display system 800 isillustrated. In the illustrated embodiment, the conventional displaysystem 800 includes a display stand base 802, a display device supportmember 804 extending from the display stand base 802, and a displaydevice 806 that is located on the display stand support member 804 andthat includes a display screen 806 a (not visible in FIG. 8, butsubstantially similar to the display screen 600 a discussed above.) Asillustrated in FIG. 8, a computing module mounting bracket 808 may beprovided with the display device 806, and mounted to the display device806 opposite the display device 800 from the display screen 806 a (e.g.,on the rear of the display device 806) via, for example, conventionalmounting features that may be provided on the display device 806according to VESA specifications. In another example, the computingmodule mounting bracket 808 may be utilized with a display devicemounting arm in order to allow the mounting arm to couple to the displaydevice and the computing module mounting bracket 808 so that thecomputing module 300 may be used with the display device mounted to thedisplay device mounting arm. As also illustrated in FIG. 8, thecomputing module 300 may then be coupled to the display device 806 bypositioning the computing module 300 in the computing module mountingbracket 808. While not illustrated, the computing module 300 may then becoupled to the display device 806 in substantially the same mannerdiscussed above with regard to block 506 of the method 500, and thenoperate to display images on the display device 806 in substantially thesame manner discussed above with regard to block 508 foo the method 500.As such, one of skill in the art in possession of the present disclosurewill appreciate that the computing modules of the present disclosure maybe utilized with conventional desktop computing system components (e.g.,via the computing module mounting bracket 808 or similar subsystems)while remaining within the scope of the present disclosure as well.

Referring now to FIGS. 9A and 9B, an embodiment of the use of thecomputing module 300 of FIGS. 3A-C with a display system 900 isillustrated. The display system 900 includes a display stand base 902having a docking connector 902 a, a display device support member 904extending from the display stand base 902, and a display device 906 thatis coupled to the display stand support member 904 and that includes adisplay screen 906 a. Similar as discussed above, the display device 906may be mounted to the display device support member 904 via, forexample, conventional mounting features that may be provided accordingto VESA specifications. As illustrated in FIG. 9B, the computing module300 may be coupled to the display device 806 by connecting the computingmodule 300 to the docking connector 902 a (e.g., via a connector on thecomputing module 300, not visible in FIG. 9B but similar to theexpansion device connector 402 illustrated in FIG. 4). As such, thecomputing module 300 may be electrically coupled to the display device906 via the docking connector at block 506 of the method 500, and thenoperates to display images on the display device 906 in substantiallythe same manner discussed above with regard to block 508 of the method500. As such, one of skill in the art in possession of the presentdisclosure will appreciate that the computing modules of the presentdisclosure may be utilized with display stand chassis having anintegrated docking connector while remaining within the scope of thepresent disclosure as well

Thus, systems and methods have been described that provide a modulardesktop computing system that provide for the removeable positioning ofa computing module into a display stand chassis that is also configuredto support any of a variety of display devices, with the computingmodule configurable to upgrade and/or add components to providedifferent operating levels for an all-in-one computing device. Themodularity of the system allows for additions of and/or replacement ofprocessing systems, memory systems, storage systems, networking systems,power systems, and any other computing components that would be apparentto one of skill in the art in possession of the present disclosure.Furthermore, the modularity of the display stand chassis allows for thehousing of different sized computing modules, and different sizes andtypes of display devices. As such, issues with regard to weakerperformance and limited upgrade options on conventional all-in-onecomputing devices are remedied, as the modular desktop computing systemof the present disclosure may be provided as an all-in-one computingdevice while allowing a user to upgrade its performance by adding orchanging components, rather than being limited to the components thatwere initially integrated into the display device.

Although illustrative embodiments have been shown and described, a widerange of modification, change and substitution is contemplated in theforegoing disclosure and in some instances, some features of theembodiments may be employed without a corresponding use of otherfeatures. Accordingly, it is appropriate that the appended claims beconstrued broadly and in a manner consistent with the scope of theembodiments disclosed herein.

What is claimed is:
 1. A modular computing system, comprising: a displaydevice configured to display an image; a display stand chassis, whereinthe display stand chassis includes a mounting subsystem and a computingmodule chassis enclosure defined by the display stand chassis; and acomputing module, comprising: a computing module chassis; a plurality ofcomputing components housed in the computing module chassis, wherein theplurality of computing components are configured to connect to thedisplay device, and wherein the computing module is configured toactivate the display device from either an external location to thedisplay stand chassis or an internal location inside the computingmodule chassis enclosure.
 2. The system of claim 1, further comprising:an expansion device that is mounted to the computing module chassis andcoupled to the plurality of computing components.
 3. The system of claim1, wherein the computing module chassis includes a plurality of wallsthat each include an outer surface and that define a computing modulecomponent enclosure that is located opposite the plurality of walls fromthe outer surfaces, and wherein the computing module chassis enclosesthe plurality of computing components that include each of: a circuitboard that is located in the computing module component enclosure; aprocessing system that is located on the circuit board and that islocated in the computing module component enclosure; a memory systemthat is located on the circuit board, that is located in the computingmodule component enclosure, and that includes instructions that, whenexecuted by the processing system, cause the processing system toprovide for the display of images on the display device; and one or moreprocessor/memory couplings that are located in the computing modulecomponent enclosure and that couple the processing system to the memorysystem.
 4. The system of claim 3, wherein the computing module chassisdefines a computing module chassis heat dissipation aperture thatextends from the computing module component enclosure to at least one ofthe outer surfaces, and wherein the computing module chassis encloses:at least one heat dissipation subsystem that is located in the computingmodule component enclosure, that is coupled to the processing system,and that is configured to dissipate heat generated by the processingsystem via the computing module chassis heat dissipation aperture. 5.The system of claim 1, wherein the computing module includes at leastone connector that is accessible on the computing module chassis, andwherein the at least one connector is configured to connect thecomputing module to the display device via at least one cable.
 6. Thesystem of claim 5, further comprising: at least one routing featureincluded on the display stand chassis, wherein the at least one routingfeature is configured to route the at least one cable between thecomputing module and the display device.
 7. The system of claim 1,further comprising: at least one locking subsystem included in thedisplay stand chassis, wherein the at least one locking subsystem isconfigured to secure the computing module chassis in the computingmodule chassis enclosure when the computing module chassis is positionedin the computing module chassis enclosure.
 8. A display device,comprising: a display configured to display an image; a stand coupled tothe display; a modular computing system configured to operate thedisplay device from either a first location or from a second location,wherein the first location is a computing module chassis defined by thestand and the second location is external to the stand; and a stand basecoupled to the stand.
 9. The IHS of claim 8, further comprising: anexpansion device that is mounted to the modular computing system andcoupled to modular computing system components included in the modularcomputing system.
 10. The IHS of claim 8, wherein the modular computingsystem includes a chassis having a plurality of walls that each includean outer surface and that define a component enclosure that is locatedopposite the plurality of walls from the outer surfaces, and wherein thechassis encloses each of: a circuit board that is located in thecomponent enclosure; a processing system that is located on the circuitboard and that is located in the component enclosure; a memory systemthat is located on the circuit board, that is located in the componentenclosure, and that includes instructions that, when executed by theprocessing system, cause the processing system to provide for thedisplay of images on the display device; and one or moreprocessor/memory couplings that are located in the component enclosureand that couple the processing system to the memory system.
 11. The IHSof claim 8, wherein the chassis defines a chassis heat dissipationaperture that extends from the component enclosure to at least one ofthe outer surfaces, and wherein the chassis encloses: at least one heatdissipation subsystem that is located in the component enclosure, thatis coupled to the processing system, and that is configured to dissipateheat generated by the processing system via the chassis heat dissipationaperture.
 12. The IHS of claim 8, further comprising: at least oneconnector that is accessible on the modular computing system, whereinthe at least one connector is configured to couple the modular computingsystem to the display via at least one cable.
 13. The IHS of claim 12,wherein the at least one connector includes a Type-C Universal SerialBus (USB) connector.
 14. A method for providing a modular computingsystem, comprising: mounting a display device to a display standchassis; positioning a computing module in one of: an external locationthat is external to a display stand chassis such that a computing modulechassis that houses the components of the computing module is locatedexternal to the display stand chassis; and a computing module chassisenclosure that is defined by a display stand chassis such that thecomputing module chassis that houses the components of the computingmodule is located in the computing module chassis enclosure defined bythe display stand chassis; and connecting, when the computing modulechassis is positioned in either the external location or the computingmodule chassis enclosure, the computing module to the display device inorder to allow the computing module to provide for the display of imageson the display device.
 15. The method of claim 15, further comprising:mounting an expansion device to the computing module chassis.
 16. Themethod of claim 15, wherein the computing module chassis includes aplurality of walls that each include an outer surface and that define acomputing module component enclosure that is located opposite theplurality of walls from the outer surfaces, and wherein the computingmodule chassis encloses each of: a circuit board that is located in thecomputing module component enclosure; a processing system that islocated on the circuit board and that is located in the computing modulecomponent enclosure; a memory system that is located on the circuitboard, that is located in the computing module component enclosure, andthat includes instructions that, when executed by the processing system,cause the processing system to provide for the display of images on thedisplay device; and one or more processor/memory couplings that arelocated in the computing module component enclosure and that couple theprocessing system to the memory system.
 17. The method of claim 16,further comprising: dissipating, using at least one heat dissipationsubsystem that is located in the computing module component enclosureand via a computing module chassis heat dissipation aperture thatextends from the computing module component enclosure to at least one ofthe outer surfaces, heat generated by the processing system.
 18. Themethod of claim 15, further comprising: connecting, using at least oneconnector that is accessible on the computing module chassis, thecomputing module to the display device via at least one cable.
 19. Themethod of claim 18, further comprising: routing, using at least onerouting feature included on the display stand chassis, the at least onecable between the computing module and the display device.
 20. Themethod of claim 15, further comprising: securing, using at least onelocking subsystem included in the display stand chassis, the computingmodule chassis in the display stand chassis when the computing modulechassis is positioned in the computing module chassis enclosure.